Mohopolo oa High Melting Point Polyamide Hot Melt Adhesive

Ho hodimo{{0}sekgomaretsi sa polyamide se qhibidihang{{1}se tjhesang{2}}ke sekgomaretsi se tjhesang{3}} se nang le polyamide resin e le karolo ya sona. E na le mocheso o qhibilihang oa likhato tse 140-150 'me e sebelisoa haholo-holo lits'ebetsong tsa ho etsa lieta tse kang ho phutha letlalo, ho hatella le ho bopa. Tokiso ea eona e kenyelletsa ho sebelisa dimer linoleic acid, sebacic acid, ethylenediamine, le hexamethylenediamine e le lisebelisoa, le ho hlahisa resin ea polyamide ka mokhoa o phahameng oa{8}}mocheso oa polycondensation tlas'a tšireletso ea naetrojene. Ts'ebetso ena e kenyelletsa ho futhumatsa ka sethala, khatello ea maikutlo, le tlhahlobo ea boleng ba amine.

Ntho e nolofatsang ea sekhomaretsi sena se ka fetoloa ka ho fetola tekanyo ea lihlahisoa tse tala, ho etsa hore e loketse ho sebetsa ka mocheso oa mocheso oa 140-200 degree. Ho kaonefatsa-thempereichara e tsitsitseng, 1% ea pyrazole{5}based anti{6}}anti-aging agent (jwalo ka 1-phenyl-3-pyrazole) hangata e eketswa motswakong wa sekgomaretsi, ho netefatsa tshebetso e tsitsitseng esita le ka 260 degrees .